MediaTek Unveils Dimensity 9300+ With Improved AI Processing

MediaTek has launched its new flagship mobile chip - the Dimensity 9300+. Introduced at the MediaTek Dimensity Developer Conference 2024, the Dimensity 9300+ is an upgraded version of the existing 9300 SoC with enhanced on-device AI capabilities.

Built on TSMC's third-generation 4nm manufacturing process, the Dimensity 9300+ packs an Arm Cortex-X4 core clocked up to 3.4GHz, three Cortex-X4 cores at 2.85GHz and four Cortex-A720 efficiency cores. Where it differs from the 9300 is in its AI processing, which is powered by MediaTek's new NeuroPilot Speculative Decode Acceleration technology.

The APU 790 AI engine now supports larger language models (LLMs) with parameters ranging from 1 billion to 33 billion. It can reportedly run 7-billion parameter models at 22 tokens per second, over double the rate of competing solutions. This improved AI performance will enable more seamless on-device generative applications.

In terms of AI collaborations, the 9300+ integrates the latest LLMs from 01.AI, Alibaba Cloud, Baichuan AI, Google and Meta. The chip also brings enhanced graphics and gaming capabilities with MediaTek's HyperEngine technology.

For imaging, the Dimensity 9300+ retains the 18-bit Imagiq 990 ISP and adds AI-based videography features. It provides sub-6GHz 5G connectivity with 4CC-CA and 7Gbps download speeds. Smartphone makers vivo and iQOO are expected to launch the first devices with the new chipset later this month.