Hyundai Mobis, Qualcomm Sign MoU for SDV and ADAS Development

Hyundai Mobis and Qualcomm Technologies have signed a memorandum of understanding at CES 2026 to collaborate on next-generation solutions for Software-Defined Vehicles and Advanced Driver Assistance Systems.

According to the two companies, this collaboration aims to deliver tailored solutions for fast-growing regions while exploring global supply opportunities.

The agreement was formalised at the Hyundai Mobis booth, attended by Jung Soo-Kyung, Executive Vice President and Head of Automotive Electronics Business Unit at Hyundai Mobis, and Nakul Duggal, Executive Vice President and Group General Manager of Automotive, Industrial and Embedded IoT and Robotics at Qualcomm Technologies.

The partnership combines Hyundai Mobis's capabilities in system integration, sensor fusion, and perception with Qualcomm Technologies' expertise in system-on-chip technology.

Initial efforts will focus on developing advanced driving and parking solutions using the Snapdragon Ride Flex SoC, targeting emerging markets such as India, where ADAS features are gaining traction across segments amid growing demand for SDV architectures.

Beyond ADAS, the companies plan to create integrated SDV solutions incorporating Hyundai Mobis's standardised software platform with Snapdragon automotive technologies to improve performance, efficiency, and system stability.

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